​​The Innovative Edge in Chip Manufacturing​​
​​Modern chip manufacturing integrates multiple cutting-edge technologies, driving the continuous advancement of the electronics industry.​​
​​5nm process technology​​

Transistor size scales down to 5 nanometers, achieving a 40% increase in integration density per unit area—delivering enhanced performance while significantly reducing power consumption.​​

Extreme Ultraviolet Lithography (EUV)​

EUV technology enables 13.5nm wavelength lithography, achieving nanometer-level precision and improving chip manufacturing yield by 15-20%.

​​3D Stacked Packaging​​

Vertically stacks multiple chip layers, reducing signal transmission distance by 30%, enhancing performance by 25%, and increasing space utilization by 50%.

​​Low-Power Design​​

Advanced power management technology reduces standby power consumption to the microwatt level, extending device battery life by over 40%.

​​Intelligent Detection System​​

AI-powered visual inspection identifies defects with 99.98% accuracy, improving production efficiency by 30% and reducing labor costs by 40%.

​​Efficient Thermal Management​​

Microchannel liquid cooling solution addresses heat dissipation for 100W+ power consumption, lowering core temperature by 35°C.

Core Technology Detailed Explanation

Breakthrough Innovative Processes and Solutions for Manufacturing Bottlenecks

​​Extreme Ultraviolet Lithography (EUV)​

​​Utilizing an extreme ultraviolet (EUV) light source with a wavelength of 13.5nm, the system employs a multi-reflective optical system for focusing, enabling the patterning of circuit features as precise as 7nm on silicon wafers - breaking through the traditional photolithography physical limitations.​​

​​Atomic Layer Deposition (ALD)​​

Atomic Layer Deposition (ALD) Technology​​ Alternately introducing different precursor gases to form single-atomic-layer films on the substrate surface, with thickness control precision reaching 0.1nm, achieving uniform deposition of ultra-thin high-k dielectric materials.

​​Wafer-Level Packaging (WLP)​​

Direct Chip Packaging on 300mm Wafers​​ Utilizes redistribution layers (RDL) and micro-bump technology for vertical interconnects, reducing package thickness to 100μm and cutting signal delay by 40%.
核心技术示意图

Multi-Domain Application Scenarios

New-generation chip technology empowers the intelligent development of various industries.

Smart Home

Low-power AI chips enable integrated voice control, environmental sensing, and power consumption management.

Medical Devices

Medical sensor chips enable high-precision vital signs monitoring and disease early-warning.

Industrial Automation

​​High-Performance Processors Power Industrial Robot Vision Recognition and Precision Control​​

 Mobile Chipset​

Delivers ​​high-frame-rate graphics rendering​​ and ​​5G multi-band communication convergence​​ in a single chip solution.

Automotive-Grade AI Chip​

Meets ​​autonomous driving decision-making safety requirements​​ with ​​multi-sensor fusion capabilities​​ for intelligent vehicle systems.

Biosensor Technology​

Enables ​​personalized skin analysis​​ and ​​precision beauty solutions​​ through real-time biological data detection.

Application Effect Demonstration​

​​Technology Transfer Results: From Laboratory to End Products​

​​5G Smartphone Processor​

​​5G Smartphone Processor​

35%
Performance Enhancement​
25%
Power Consumption Reduction​
12TOPS
​​AI Computing Power​

Next-Generation Heterogeneous Computing Architecture​​ Integrating 5G baseband and AI coprocessor, enabling 8K video processing and real-time language translation capabilities

Portable Medical Detection Chip​

Portable Medical Detection Chip​

99.2%
Detection Accuracy​
0.8s
Response Time​
14DAY
​​Battery Life​

Integrated Multi-Biosensor Solution​​ Simultaneous monitoring of 7 health parameters: blood glucose, blood oxygen, ECG, body temperature, etc. Data error rate <1.5%